This position will require the candidate to have a in depth knowledge in SMT and through hole assembly, rework of these devices, soldering materials (including low temperature solder alloys), very large body BGA assembly processes, mechanical assembly of PCBA’s into chassis.
(2) work with Cisco Design teams on DFM issues. Responsibilities include: Process development on new components, connectors with unique interconnect structures. Failure analysis support and risk assessment on PCBA with assembly related issues. Acts as a senior technical contributor to Cisco. Integration of liquid cooling systems...